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    Atomic layer deposition (ALD) of nanoscale coatings on SrAl2O4-based phosphor powders to prevent aqueous degradation
    (Wiley, 2020) Karacaoglu, Erkul; Ozturk, Esra; Uyaner, Mesut; Losego, Mark D.
    The aqueous degradation of Eu2+-activated and Dy3+-codoped strontium aluminate (SrAl2O4:Eu2+, Dy3+, SA2-Green) long afterglow phosphors synthesized from solid-state reaction and coated with nanoscale metal oxide protective layers (<= 12 nm) via atomic layer deposition (ALD) is investigated. Uncoated phosphor powders degrade rapidly upon water immersion and lose their green phosphorescence within 48 hours of water exposure. Postmortem investigations reveal hydration and decomposition of the SrAl2O4 phase. ALD of 10 nm Al2O3 or 12 nm TiO2 is found to significantly improve the powder's resistance to aqueous degradation. All ALD-coated powders show minimal structural and chemical degradation and retain phosphoresence after 48 hours of water immersion. This enhanced durability offers a new pathway for applying long afterglow phosphors to outdoor applications like roadway markings or safety signage and for their incorporation into more eco-friendly waterborne coatings.
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    The measurements of electrical and thermal conductivity variations with temperature and phonon component of the thermal conductivity in Sn-Cd-Sb, Sn-In-Cu, Sn-Ag-Bi and Sn-Bi-Zn alloys
    (Elsevier France-Editions Scientifiques Medicales Elsevier, 2016) Altintas, Yemliha; Kaygisiz, Yusuf; Ozturk, Esra; Aksoz, Sezen; Keslioglu, Kazim; Marasli, Necmettin
    The electrical and thermal conductivity variations with temperature for lead-free ternary solders, namely Sn-41.39 at.% Cd-6.69 at.% Sb, Sn-49 at.% In-1 at.% Cu, Sn-50 at.% Ag-10 at.% Bi and Sn-32 at.% Bi-3 at.% Zn alloys, were measured by the d.c. four-point probe method and radial heat flow apparatus, respectively. The contributions of electrons and phonons to the thermal conductivity were separately determined by using the measured values of the thermal and electrical conductivities obtained by the Wiedemann-Franz law in the lead-free ternary solders. The percentages of the phonon component of thermal conductivity were found to be in the range of 46-55%, 46-50%, 38-47% and 69-73% for Sn-41.39 at.% Cd-6.69 at.% SU, Sn-49 at.% In-1 at.% Cu, Sn-50 at.% Ag-10 at.% Bi and Sn-32 at.% Bi-3 at.% Zn alloys at the ranges of 318-443 K temperature, respectively. The temperature coefficients (alpha) of electrical conductivity for the lead-free ternary solders were found to be 2.47 x 10(-3), 4.97 x 10(-3), 1.14 x 10(-3) and 1.00 x 10(-3) K-1, respectively. The thermal conductivities of the solid phases at their melting temperature and the thermal temperature coefficients for the lead-free ternary solders were also found to be 47.72 +/- 2.38, 68.57 +/- 3.42, 73.52 +/- 3.67, 37.53 +/- 1.87 W/Km and 1.47 x 10(-3), 1.48 x 10(-3), 1.85 x 10(-3) and 2.21 x 10(-3) K-1, respectively. (C) 2015 Elsevier Masson SAS. All rights reserved.