The rate of Cu doped TiO2 interlayer effects on the electrical characteristics of Al/Cu:TiO2/n-Si (MOS) capacitors depend on frequency and voltage
dc.contributor.author | Erdal, M. O. | |
dc.contributor.author | Kocyigit, A. | |
dc.contributor.author | Yildirim, M. | |
dc.date.accessioned | 2024-02-23T14:13:17Z | |
dc.date.available | 2024-02-23T14:13:17Z | |
dc.date.issued | 2020 | |
dc.department | NEÜ | en_US |
dc.description.abstract | In order to determine the surface states (N-ss), series resistance (R-s), and (Cu:TiO2) interlayer effects on the electrical characteristics of the Al/Cu:TiO2/n-Si metal oxide semiconductor (MOS) capacitors, both capacitance (C) and conductance (G) values were measured for frequency ranges of 10 kHz-1 MHz and +/- 5 V voltage ranges. In addition, to know Cu doping concentration effect on the MOS capacitor, the Al/Cu:TiO2/n-Si was fabricated with various rates Cu:TiO2 interlayer (5, 10, 15%) grown on n-Si susbtrate by spin-coating. The increase in capacitance via decreasing frequencies was attributed to the existence of N-ss and their relaxation time. The frequency dependent diffusion potential (V-d), doping of donor atoms (N-d), Fermi energy (E-F), barrier height (Phi b) and depletion layer width (W-d) values were extracted from the linear part of reverse bias C-2-V curves. While the value the R-s decreased with increasing frequency, the N-ss values increased for the three MOS capacitors. The profiles of N-ss and R-s depending on voltage were also plotted by Nicollian-Brews methods and using high-low frequency (C-HF-C-LF) capacitance, respectively. The mean values of N-ss for three capacitors were found at about 10(12) eV(-1)cm(-2) as suitable electronic devices. The lower values of the N-ss can be attributed to passivation effect of Cu:TiO2 interlayer. | en_US |
dc.identifier.doi | 10.1016/j.microrel.2020.113591 | |
dc.identifier.issn | 0026-2714 | |
dc.identifier.scopus | 2-s2.0-85078228036 | en_US |
dc.identifier.scopusquality | Q2 | en_US |
dc.identifier.uri | https://doi.org/10.1016/j.microrel.2020.113591 | |
dc.identifier.uri | https://hdl.handle.net/20.500.12452/12358 | |
dc.identifier.volume | 106 | en_US |
dc.identifier.wos | WOS:000517853100003 | en_US |
dc.identifier.wosquality | Q3 | en_US |
dc.indekslendigikaynak | Web of Science | en_US |
dc.indekslendigikaynak | Scopus | en_US |
dc.language.iso | en | en_US |
dc.publisher | Pergamon-Elsevier Science Ltd | en_US |
dc.relation.ispartof | Microelectronics Reliability | en_US |
dc.relation.publicationcategory | Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı | en_US |
dc.rights | info:eu-repo/semantics/closedAccess | en_US |
dc.subject | Al/Cu:Tio2/N-Si (Mos) Capacitors | en_US |
dc.subject | Surface States | en_US |
dc.subject | Series Resistance | en_US |
dc.subject | Cu Doping Effect | en_US |
dc.title | The rate of Cu doped TiO2 interlayer effects on the electrical characteristics of Al/Cu:TiO2/n-Si (MOS) capacitors depend on frequency and voltage | en_US |
dc.type | Article | en_US |