The measurements of electrical and thermal conductivity variations with temperature and phonon component of the thermal conductivity in Sn-Cd-Sb, Sn-In-Cu, Sn-Ag-Bi and Sn-Bi-Zn alloys

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dc.contributor.authorAltintas, Yemliha
dc.contributor.authorKaygisiz, Yusuf
dc.contributor.authorOzturk, Esra
dc.contributor.authorAksoz, Sezen
dc.contributor.authorKeslioglu, Kazim
dc.contributor.authorMarasli, Necmettin
dc.date.accessioned2024-02-23T14:03:15Z
dc.date.available2024-02-23T14:03:15Z
dc.date.issued2016
dc.departmentNEÜen_US
dc.description.abstractThe electrical and thermal conductivity variations with temperature for lead-free ternary solders, namely Sn-41.39 at.% Cd-6.69 at.% Sb, Sn-49 at.% In-1 at.% Cu, Sn-50 at.% Ag-10 at.% Bi and Sn-32 at.% Bi-3 at.% Zn alloys, were measured by the d.c. four-point probe method and radial heat flow apparatus, respectively. The contributions of electrons and phonons to the thermal conductivity were separately determined by using the measured values of the thermal and electrical conductivities obtained by the Wiedemann-Franz law in the lead-free ternary solders. The percentages of the phonon component of thermal conductivity were found to be in the range of 46-55%, 46-50%, 38-47% and 69-73% for Sn-41.39 at.% Cd-6.69 at.% SU, Sn-49 at.% In-1 at.% Cu, Sn-50 at.% Ag-10 at.% Bi and Sn-32 at.% Bi-3 at.% Zn alloys at the ranges of 318-443 K temperature, respectively. The temperature coefficients (alpha) of electrical conductivity for the lead-free ternary solders were found to be 2.47 x 10(-3), 4.97 x 10(-3), 1.14 x 10(-3) and 1.00 x 10(-3) K-1, respectively. The thermal conductivities of the solid phases at their melting temperature and the thermal temperature coefficients for the lead-free ternary solders were also found to be 47.72 +/- 2.38, 68.57 +/- 3.42, 73.52 +/- 3.67, 37.53 +/- 1.87 W/Km and 1.47 x 10(-3), 1.48 x 10(-3), 1.85 x 10(-3) and 2.21 x 10(-3) K-1, respectively. (C) 2015 Elsevier Masson SAS. All rights reserved.en_US
dc.description.sponsorshipErciyes University Research Foundation [FBA-2013-4746]; Nevsehir Haci Bektas Veli University Research Foundation [NEUADP13F15]en_US
dc.description.sponsorshipThis project was supported by the Erciyes University Research Foundation under Contract No: FBA-2013-4746 and by the Nevsehir Haci Bektas Veli University Research Foundation under Contract No: NEUADP13F15. The authors would like to thank Erciyes University and Nevsehir Haci Bektas Veli University Research Foundations for their financial support.en_US
dc.identifier.doi10.1016/j.ijthermalsci.2015.09.004
dc.identifier.endpage9en_US
dc.identifier.issn1290-0729
dc.identifier.issn1778-4166
dc.identifier.scopus2-s2.0-84944096383en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage1en_US
dc.identifier.urihttps://doi.org/10.1016/j.ijthermalsci.2015.09.004
dc.identifier.urihttps://hdl.handle.net/20.500.12452/12034
dc.identifier.volume100en_US
dc.identifier.wosWOS:000368207700001en_US
dc.identifier.wosqualityQ1en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherElsevier France-Editions Scientifiques Medicales Elsevieren_US
dc.relation.ispartofInternational Journal Of Thermal Sciencesen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectMetals And Alloysen_US
dc.subjectPhononsen_US
dc.subjectThermoelectricen_US
dc.subjectThermal Analysisen_US
dc.titleThe measurements of electrical and thermal conductivity variations with temperature and phonon component of the thermal conductivity in Sn-Cd-Sb, Sn-In-Cu, Sn-Ag-Bi and Sn-Bi-Zn alloysen_US
dc.typeArticleen_US

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