Rapid thermal processing of cost-effective contacts for silicon solar cells
Küçük Resim Yok
Tarih
2019
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Wiley
Erişim Hakkı
info:eu-repo/semantics/openAccess
Özet
This paper reports on the investigation of rapid thermal processing (RTP) of contacting the Al-BSF solar cell with Ag, Cu, and Ni in conjunction with aerosol printing technique. The study showed a liftoff and delamination, respectively, for the bi and tri stack layers of Ag frit/Ni and Ag frit/Ni/Cu fired above 790 degrees C peak firing temperature. The 770 degrees C peak firing temperature gave excellent electrical performance for both bi and tri stack layer contacts, which is not favorable to forming thick back surface field (BSF) required for high open circuit voltage (V-OC). This suggests that the bilayer and trilayer contacts involving Ag frit are limited to low peak firing temperature, but Ni frit, on the other hand, showed a wider firing temperature range. This is supported by low reverse saturation current density (J(02)) of 1.1 x 10(-11) A/cm(2) and high shunt resistance (R-SH) of 5750 omega center dot cm(2) for the Ni frit fired at 800 degrees C peak firing temperature. More so, the adhesion of Ni Frit to silicon is better than Ag counterpart as evidenced in the SEM micrograph. Thus, by adopting RTP Ni/Cu contacts, the cost of metallization of solar cell can be dropped from 35% of total processing cost to only 5% to 6%, which is approximately 30% drop in the total cost of processing.
Açıklama
Anahtar Kelimeler
Aerosol Printing, Copper Contacts, Metallization, Nickel Contacts, Passivated Emitter Rear Contact (Perc) Cells, Plating, Si Solar Cells
Kaynak
Progress In Photovoltaics
WoS Q Değeri
Q1
Scopus Q Değeri
Q1
Cilt
27
Sayı
5
