Microstructural, mechanical, and electrical characterization of directionally solidified Al-Cu-Mg eutectic alloy
Küçük Resim Yok
Tarih
2017
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Maik Nauka/Interperiodica/Springer
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
The composition of an Al-Cu-Mg ternary eutectic alloy was chosen to be Al-30 wt% Cu-6 wt % Mg to have the Al2Cu and Al2CuMg solid phases within an aluminum matrix (alpha-Al) after its solidification from the melt. The alloy Al-30 wt % Cu-6 wt % Mg was directionally solidified at a constant temperature gradient (G = 8.55 K/mm) with different growth rates V, from 9.43 to 173.3 mu m/s, by using a Bridgman-type furnace. The lamellar eutectic spacings (lambda(E)) were measured from transverse sections of the samples. The functional dependencies of lamellar spacings lambda(E) ( lambda(Al2CuMg) and lambda(Al2Cu), in mu m), microhardness H-V (in kg/mm(2)), tensile strength sigma(T) (in MPa), and electrical resistivity rho (in Omega m) on the growth rate V (in mu m/s) were obtained as lambda(Al2CuMg)=3.05V(-0.31), lambda(Al2Cu)=6.35(-0.35),H-v = 308.3(V)(0.03) sigma(T)= 408.6(V)(0.14), and rho = 28.82 x 10(-8)(V)(0.11), respectively for the Al-Cu-Mg eutectic alloy. The bulk growth rates were determined as lambda(2)(Al2CuMg) V= 93.2 and lambda(2)(Al2Cu) V=195.76 mu m(3)/s by using the measured values of lambda(Al2CuMg), lambda(Al2Cu) and V. A comparison of present results was also made with the previous similar experimental results.
Açıklama
Anahtar Kelimeler
Directional Solidification, Aluminum Alloys, Microstracture, Electrical Properties, Hardness Test
Kaynak
Physics Of Metals And Metallography
WoS Q Değeri
Q3
Scopus Q Değeri
Q3
Cilt
118
Sayı
4
