Microstructural, mechanical, and electrical characterization of directionally solidified Al-Cu-Mg eutectic alloy

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dc.contributor.authorKaygisiz, Yusuf
dc.contributor.authorMarasli, Necmettin
dc.date.accessioned2024-02-23T14:26:10Z
dc.date.available2024-02-23T14:26:10Z
dc.date.issued2017
dc.departmentNEÜen_US
dc.description.abstractThe composition of an Al-Cu-Mg ternary eutectic alloy was chosen to be Al-30 wt% Cu-6 wt % Mg to have the Al2Cu and Al2CuMg solid phases within an aluminum matrix (alpha-Al) after its solidification from the melt. The alloy Al-30 wt % Cu-6 wt % Mg was directionally solidified at a constant temperature gradient (G = 8.55 K/mm) with different growth rates V, from 9.43 to 173.3 mu m/s, by using a Bridgman-type furnace. The lamellar eutectic spacings (lambda(E)) were measured from transverse sections of the samples. The functional dependencies of lamellar spacings lambda(E) ( lambda(Al2CuMg) and lambda(Al2Cu), in mu m), microhardness H-V (in kg/mm(2)), tensile strength sigma(T) (in MPa), and electrical resistivity rho (in Omega m) on the growth rate V (in mu m/s) were obtained as lambda(Al2CuMg)=3.05V(-0.31), lambda(Al2Cu)=6.35(-0.35),H-v = 308.3(V)(0.03) sigma(T)= 408.6(V)(0.14), and rho = 28.82 x 10(-8)(V)(0.11), respectively for the Al-Cu-Mg eutectic alloy. The bulk growth rates were determined as lambda(2)(Al2CuMg) V= 93.2 and lambda(2)(Al2Cu) V=195.76 mu m(3)/s by using the measured values of lambda(Al2CuMg), lambda(Al2Cu) and V. A comparison of present results was also made with the previous similar experimental results.en_US
dc.description.sponsorshipErciyes University Scientific Research Project Unit [FBD-12-4122]en_US
dc.description.sponsorshipThis project was supported by Erciyes University Scientific Research Project Unit under Contract no. FBD-12-4122. The authors are grateful to Erciyes University Scientific Research Project Unit for their financial supports.en_US
dc.identifier.doi10.1134/S0031918X17040123
dc.identifier.endpage398en_US
dc.identifier.issn0031-918X
dc.identifier.issn1555-6190
dc.identifier.issue4en_US
dc.identifier.scopus2-s2.0-85018764787en_US
dc.identifier.scopusqualityQ3en_US
dc.identifier.startpage389en_US
dc.identifier.urihttps://doi.org/10.1134/S0031918X17040123
dc.identifier.urihttps://hdl.handle.net/20.500.12452/14081
dc.identifier.volume118en_US
dc.identifier.wosWOS:000401084800009en_US
dc.identifier.wosqualityQ3en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherMaik Nauka/Interperiodica/Springeren_US
dc.relation.ispartofPhysics Of Metals And Metallographyen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectDirectional Solidificationen_US
dc.subjectAluminum Alloysen_US
dc.subjectMicrostractureen_US
dc.subjectElectrical Propertiesen_US
dc.subjectHardness Testen_US
dc.titleMicrostructural, mechanical, and electrical characterization of directionally solidified Al-Cu-Mg eutectic alloyen_US
dc.typeArticleen_US

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