Directional solidification of Al-Cu-Si-Mg quaternary eutectic alloy

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dc.contributor.authorKaygisiz, Yusuf
dc.contributor.authorMarasli, Necmettin
dc.date.accessioned2024-02-23T14:12:31Z
dc.date.available2024-02-23T14:12:31Z
dc.date.issued2017
dc.departmentNEÜen_US
dc.description.abstractThe effects of growth rates on the microstructure, microhardness, tensile strength, and electrical resistivity were studied in directionally solidified Al-Cu -Si -Mg (A1-28 wt%Cu-6wt.%Si-2.2 wt%Mg) quaternary eutectic alloy. The directional solidification process was carried out at five different growth rates (V = 9.63-173.5 mu m/s) at a constant temperature gradient (G = 6.88 Kimm). The microstructure of the directionally solidified Al-Cu-Si-Mg quaternary eutectic alloy consists of Al solid solution, irregular Si plates, and intermetallic Al2Cu (theta) and Cu2Mg8Si6Al5 (Q) phases with honeycomb morphology. The dependencies of lamellar spacing, microhardness, tensile strength, and electrical resistivity on growth rates were found to be lambda(CuAl2) = 19.05 V-041, lambda(Cu2Mg8Si6Al5) = 51.28 V-0.43, lambda(si) = 8.74 V-0.46, HV = 170.7 + 79.08V(0.25), HV = 237.68(V)(0.043) sigma = 343.45(V)(0.15), and rho = 3.42 x 10(-8)(V)(0.10) orespectively, for the Al-Cu-Si-Mg quaternary eutectic alloy. The bulk growth rates were also determined lambda(2)(si) V = 92.24, lambda(2)(CuAl2) = 669.2, and lambda(Cu2Mg8Si6Al5) V = 4205.5 mu(3)/s by using the measured values of lambda Mg2Si, lambda(CuAl2), lambda(Cu2Mg8Si6Al5), and V for the Si plates and intermetallic Al2Cu (theta) and Cu2Mg8Si6Al5 (Q) phases in the Al-Cu-Si-Mg eutectic alloy, respectively. (C) 2017 Elsevier B.V. All rights reserved.en_US
dc.description.sponsorshipErciyes University Scientific Research Project Unit [FBD-12-4122]; Erciyes University Scientific Research Project Uniten_US
dc.description.sponsorshipThis project was supported by Erciyes University Scientific Research Project Unit under Contract No. FBD-12-4122. The authors are grateful to Erciyes University Scientific Research Project Unit for financial support.en_US
dc.identifier.doi10.1016/j.jallcom.2017.06.027
dc.identifier.endpage771en_US
dc.identifier.issn0925-8388
dc.identifier.issn1873-4669
dc.identifier.scopus2-s2.0-85020668504en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage764en_US
dc.identifier.urihttps://doi.org/10.1016/j.jallcom.2017.06.027
dc.identifier.urihttps://hdl.handle.net/20.500.12452/12095
dc.identifier.volume721en_US
dc.identifier.wosWOS:000405252400089en_US
dc.identifier.wosqualityQ1en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.publisherElsevier Science Saen_US
dc.relation.ispartofJournal Of Alloys And Compoundsen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectDirectional Solidificationen_US
dc.subjectQuaternary Eutectic Alloyen_US
dc.subjectAluminium Alloyen_US
dc.subjectMicrostructureen_US
dc.subjectElectrical Propertiesen_US
dc.titleDirectional solidification of Al-Cu-Si-Mg quaternary eutectic alloyen_US
dc.typeArticleen_US

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